Wireless ECG Circuit on Flexible Material: A Preliminary Study
Keywords:Flexible Circuit, Silicon Rubber, Thermoplastic Polyurethane, Vinyl Cutter, Wireless ECG System,
AbstractFlexible printed circuit is rapidly developing in the electronics industry. However, the circuit substrate of flexible materials limited due to its temperature limitation characteristics. In this study, two flexible materials were tested: a silicon rubber and a thermoplastic polyurethane (TPU). The effectiveness of the fabrication process on both materials was compared using a vinyl cutter. Results showed that the TPU material is better for the fabrication process due to the roughness of its surface which is higher than silicon rubber that makes the adhesion of the copper tape stronger on the surface.
R. Virmani, A. P. Burke, and A. Farb, “Sudden cardiac death,” Cardiovasc. Pathol., vol. 10, no. 5, pp. 211–218, 2001.
C. Schmied and M. Borjesson, “Sudden cardiac death in athletes,” J. Intern. Med., vol. 275, no. 2, pp. 93–103, 2014.
B. J. Maron, “Preparticipation cardiovascular evaluation of the competitive athlete : perspectives from the 30-year Italian experience,” Am. J. Cardiol. vol. 75, issue 12, pp. 827–829, 1994.
C. O. Balderrama-Armendariz, E. Macdonald, E. D. Valadez, and D. Espalin, “Folding endurance appraisal for thermoplastic materials printed in fusion deposition technology,” in Proceedings of the 27th Annual Int. Solid Freeform Fabrication Symposium, Texas, pp. 2348– 2357, 2016.
A. A. Mohammed, “Development of a new stretchable and screen printable conductive ink,” Ph.D Thesis, University of Maryland, pp. 1– 138, 2017.
J. C. Huhta and J. G. Webster, “60-Hz interference in electrocardiography,” IEEE Trans. Biomed. Eng., vol. BME-20, no. 2, pp. 91–101, 1973.
J. P. M. Hoefnagels, C. A. Buizer, and M. G. D. Geers, “A miniaturized contactless pure-bending device for in-situ SEM failure analysis” in Experimental and Applied Mechanics, Volume 6: Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics. Springer-Verlag: New York, 2011, pp. 587–596.
H. A. Andersson, A. Manuilskiy, S. Haller, M. Hummelgård, J. Sidén, C. Hummelgård, H. Olin, and H.-E. Nilsson, “Assembling surface mounted components on ink-jet printed double sided paper circuit board.,” Nanotechnology, vol. 25, no. 9, p. 94002, 2014.
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