Time Influence on Thickness and Grains for Molybdenum Thin Film

Authors

  • Muhtade Mustafa Aqil Faculty of Electronics and Computer Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia.
  • Mohd Asyadi Azam Carbon Research Technology Research Group Advanced Manufacturing Centre, Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia.
  • Rhonira Latif Institutes of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia.
  • Fauziyah Salehuddin Faculty of Electronics and Computer Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia.

Keywords:

Atomic Force Microscopy, DC Magnetron Sputtering, Surface Profile, Thin Film,

Abstract

In this paper, DC magnetron sputtering technique was used to deposit high purity molybdenum (Mo) thin films on blank Si substrate. The deposition condition for all samples has not been changed except for the deposition time in order to study the time influence on the surface morphology of the molybdenum. The surface profiler has been sued to measure the surface thickness. Atomic force microscopy technique was employed to investigate grain structure of Mo thin film. Grains analysis and thickness for all samples show a direct relation with time. The thickness and grain parameters of molybdenum thin films increase with respect to time. Grain area, size, length and perimeter parameters are used in grain analysis.

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Published

2017-09-27

How to Cite

Aqil, M. M., Azam, M. A., Latif, R., & Salehuddin, F. (2017). Time Influence on Thickness and Grains for Molybdenum Thin Film. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 9(2-13), 69–73. Retrieved from https://jtec.utem.edu.my/jtec/article/view/2568

Issue

Vol. 9 No. 2-13: Research and Innovation towards Sustainability in Electronic Engineering

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Articles

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