A Review of Characterization Techniques for Material's Properties Measurement using Microwave Resonant Sensor
Keywords:
Accuracy, Characterization, Capability, Methods, Microwave, Resonators, Resonant, Sensitivity, Split Ring, Sensor, TechniquesAbstract
This paper presents a compilation of important review in the development of microwave resonant sensor technology used in previous years. The major research work for each year is reviewed. Most of the resonators are designed for material characterization in specific application areas such as food quality control, medical, bio-sensing and subsurface detection. In the last few years, several resonant sensors based on the planar and non-planar structure are compared and examined in order to propose a new topology of microwave sensors designed. The weaknesses of conventional sensors such as bulky size, high cost manufacturing and consume high volumes of detectable sample have been reviewed. Most significantly, this new proposed structure must gain high quality factor to gain improvement in an accuracy of the sensing capability and can overcome previous design weaknesses. This device will discriminate the composition and properties of samples based on scattering parameters in certain operating frequency. The proposed system outlined in this paper, featuring new innovation in resonator structure as well as providing advanced capability design of future research works. The contribution of this study is useful for various types of applications where the characterizing of materials is very important, while improving its performance especially in terms of accuracy and sensitivity. The previous studies will be reviewed and critically compared in order to gain a better understanding in microwave resonant sensors and new ideas for further research improvement in application, which require characterizing of materials.Downloads
How to Cite
Issue
Section
License
TRANSFER OF COPYRIGHT AGREEMENT
The manuscript is herewith submitted for publication in the Journal of Telecommunication, Electronic and Computer Engineering (JTEC). It has not been published before, and it is not under consideration for publication in any other journals. It contains no material that is scandalous, obscene, libelous or otherwise contrary to law. When the manuscript is accepted for publication, I, as the author, hereby agree to transfer to JTEC, all rights including those pertaining to electronic forms and transmissions, under existing copyright laws, except for the following, which the author(s) specifically retain(s):
- All proprietary right other than copyright, such as patent rights
- The right to make further copies of all or part of the published article for my use in classroom teaching
- The right to reuse all or part of this manuscript in a compilation of my own works or in a textbook of which I am the author; and
- The right to make copies of the published work for internal distribution within the institution that employs me
I agree that copies made under these circumstances will continue to carry the copyright notice that appears in the original published work. I agree to inform my co-authors, if any, of the above terms. I certify that I have obtained written permission for the use of text, tables, and/or illustrations from any copyrighted source(s), and I agree to supply such written permission(s) to JTEC upon request.