Influential Factors on Switch Power Losses of a Buck Converter: A Reliability Approach

Authors

  • Omid Alavi K.N. Toosi University of Technology
  • Abbas Hooshmand Viki K.N. Toosi University of Technology

Keywords:

DC?DC power converters, reliability, semiconductor device reliability, switching loss.

Abstract

Over the past several decades, with expanding utilization of power electronic devices, attention to the lifetime and reliability has become more momentous than before. Furthermore, different parameters can affect the reliability of devices. For this reason, a comprehensive assessment of influential factors needs to be conducted. In this paper, the switch power losses as the most significant factor in the reliability evaluation are studied. The simulation of the considered DC-DC buck converter was carried out using Matlab/Simulink. The results illustrate that the increase of switching frequency and the input voltage level leads to an increased switch power losses, whereas the opposite is true for the modulation index. Additionally, the results from the analysis conducted on three levels of output powers clarify that the power losses increases by higher output power, but the increasing rate is almost constant. However, the rising ratio of the power losses follows a downward trend with the increase of modulation index. A Gaussian function is able to model the junction temperature of the examined IGBT with an acceptable accuracy. This model can eliminate the need for additional calculations when new conditions for a buck converter are defined. The results obtained from this study confirmed that different criteria such as selecting the appropriate type of IGBT module must be considered for circuit design with reduced switching losses and longer lifespan.

References

I. Dincer, “Renewable energy and sustainable development: a crucial review,” Renew. Sustain. Energy Rev., vol. 4, no. 2, pp. 157–175, 2000.

S. Chander, P. Agarwa, I. Gupta, “Auto-tuned, discrete PID controller or DC-DC converter for fast transient response,” Int. Conf. Power Electron., pp. 1-7, 2011.

J. Jones and J. Hayes, “Estimation of system reliability using a ‘non-constant failure rate’ model,” IEEE Trans. Reliab., vol. 50, no. 3, pp. 286 – 288, 2001.

A. Høyland and M. Rausand, System reliability theory: models and statistical methods. Wiley, 2009.

P. Wikström, L. Terens, and H. Kobi, “Reliability, availability, and maintainability of high-power variable-speed drive systems,” IEEE Trans. Ind. Appl., vol. 36, no. 1, pp. 231–241, 2000.

E. Strangas, S. Aviyente, J. Neely, and S. Zaidi, “Improving the reliability of electrical drives through failure prognosis,” in Proc. IEEE Int. Symp. Diagn. Electron. Mach., Power Electron. Drives, Sep. 2011, pp. 172–178.

A. Stupar, D. Bortis, U. Drofenik, and J. W. Kolar, “Advanced setup for thermal cycling of power modules following definable junction temperature profiles,” in Proc. IPEC, Sapporo, Japan, pp. 962–969, 2010.

M. T. Zhang, M. M. Jovanovic, and F. C. Lee, “Design and analysis of thermal management for high-power-density converters in sealed enclosures,” in Proc. 12th Annu. Appl. Power Electron. Conf. Expo., vol. 1, pp. 405–412, 1997.

M. Bašić, D. Vukadinović, and M. Polić, “Analysis of Power Converter Losses in Vector Control System of a Self–Excited Induction Generator,” J. Electr. Eng., vol. 65, no. 2, pp. 65–74, 2014.

M. Usui, M. Ishiko, "Simple Approach of Heat Dissipation Design for Inverter Module," Proc. of Int. Power Electron. Conf. (IPEC), pp. 1598-1603, 2005.

T. Y. Lee and M. Mahalingam, “Application of a CFD Tool for System-Level Thermal Simulation,” IEEE Trans. Comp. Pack. Manuf. Tech., vol. 17, no. 4, pp.564 -571, 1994.

Fuji IGBT Module U-Series 2MBI150U2A-060 Datasheet. (Available: www.fujielectric.com)

R. W. Erickson and D. Maksimovic´, Fundamentals of Power Electronics, 2nd ed. Boston, MA: Kluwer, 2000.

V. R. Tintu and M. George, “Tapped inductor technology based DC-DC converter", Proc. ICSCCN, pp.747 -753, 2011.

H. Wang, K. Ma, and F. Blaabjerg, “Design for reliability of power electronic systems,” in Proc. IEEE Ind. Electron. Soc. Annu. Conf., pp. 33–44, 2012.

M.R. Lyu, Handbook of Software Reliability Engineering. McGraw-Hill, 1996.

R. F. Stapelberg, Handbook of Reliability, Availability, Maintainability and Safety in Engineering Design, Springer-Verlag, London, 2009.

M. G. Pecht, F. R. Nash, “Predicting the Reliability of Electronic Equipment,” In Proceedings of the IEEE, vol. 82, pp. 992-1004, 1994.

Military Handbook - Reliability Prediction of Electronic Equipment, MIL-HDBK-217F Notice 2, Feb 28, 1995.

B. Abdi, A. H. Ranjbar, G. B. Gharehpetian, and J. Milimonfared, “Reliability considerations for parallel performance of semiconductor switches in high-power switching power supplies,” IEEE Trans. Ind. Electron., vol. 56, no. 6, pp. 2133–2139, Jun. 2009.

N. Palumbo. “Thermal Analysis of an Integrated Power Electronics Module,” PhD Diss. Rensselaer Polytechnic Institute, 2012.

D. Graovac, M. Pürschel, “IGBT power losses calculation using the data-sheet parameters,” Infineon Application Note, January 2009, pp. 1–17.

C. W. Dawson, R. J. Abrahart, L. M. See, “HydroTest: a web-based toolbox of evaluation metrics for the standardised assessment of hydrological forecasts,” Environ. Modell. Software, vol. 22, no. 7, pp. 1034–1052, 2007.

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Published

2016-08-01

How to Cite

Alavi, O., & Hooshmand Viki, A. (2016). Influential Factors on Switch Power Losses of a Buck Converter: A Reliability Approach. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 8(5), 1–6. Retrieved from https://jtec.utem.edu.my/jtec/article/view/567

Issue

Vol. 8 No. 5: May - August 2016

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Articles

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