Piezoelectric Energy Harvesting System Via Impact and Vibration – A Review

Authors

  • N. X. Yan Centre for Telecommunication Research & Innovation(CeTRI),Fakulti Kejuruteraan Elektronik dan Kejuruteraan Komputer (FKEKK), Universiti Teknikal Malaysia Melaka (UTeM), Durian Tunggal, 76100 Melaka, Malaysia.
  • A. A. Basari Centre for Telecommunication Research & Innovation(CeTRI),Fakulti Kejuruteraan Elektronik dan Kejuruteraan Komputer (FKEKK), Universiti Teknikal Malaysia Melaka (UTeM), Durian Tunggal, 76100 Melaka, Malaysia.
  • K. S. Leong Centre for Telecommunication Research & Innovation(CeTRI),Fakulti Kejuruteraan Elektronik dan Kejuruteraan Komputer (FKEKK), Universiti Teknikal Malaysia Melaka (UTeM), Durian Tunggal, 76100 Melaka, Malaysia.
  • N. A. A. Nawir Centre for Telecommunication Research & Innovation(CeTRI),Fakulti Kejuruteraan Elektronik dan Kejuruteraan Komputer (FKEKK), Universiti Teknikal Malaysia Melaka (UTeM), Durian Tunggal, 76100 Melaka, Malaysia.

Keywords:

Energy Harvesting, Piezoelectric Transducer, Vibration, Impact-Based,

Abstract

Recently, the vibrational energy harvesting devices have been studied and developed significantly. Although battery is the main power source for electronic devices, it still has some limitations, particularly its life time. Piezoelectric transducer is one of the devices that can be used for the vibration energy harvesting system. It has higher power density compared to the others. A comprehensive review on piezoelectric energy harvesting system is discussed and presented in this paper. The techniques of the piezoelectric energy harvester such as impact and vibration modes are reviewed. The power generator developed for the impact-based piezoelectric energy harvester is addressed in this paper. It can be concluded that the piezoelectric energy harvesting system can generate output power in the range of 34.6nW to 1.34W.

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Published

2019-03-31

How to Cite

Yan, N. X., Basari, A. A., Leong, K. S., & Nawir, N. A. A. (2019). Piezoelectric Energy Harvesting System Via Impact and Vibration – A Review. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 11(1), 35–41. Retrieved from https://jtec.utem.edu.my/jtec/article/view/5176

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Vol. 11 No. 1: January - March 2019

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