Effect of Beams Structures on Dynamic Behavior of Piezoresistive Accelerometer Sensors

Authors

  • Norliana Yusof Faculty of Innovative Design and Technology, Universiti Sultan Zainal Abidin, Gong Badak Campus, 21300 Kuala Terengganu
  • Norhayati Soinb Department of Electrical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur
  • Abdullah C.W. Noorakma Faculty of Innovative Design and Technology, Universiti Sultan Zainal Abidin, Gong Badak Campus, 21300 Kuala Terengganu

Keywords:

Static Analysis, Dynamic Analysis, MEMS Piezoresistive Accelerometer Sensor, COMSOL Multiphysics,

Abstract

This paper presents the design and simulation analysis of MEMS piezoresistive accelerometer sensor which can be used as airbag sensors. In this study, five different shapes of accelerometer structures with identical proof mass volume are designed and simulated by using Comsol Multiphysics software. The static analysis and modal analysis were conducted to investigate the stress, displacement, strain and resonant frequency of each structure. From the static analysis, it can be observed that structure with four beams parallel to the proof mass and attached at the edge of it, perform the highest value of stress, 6.78 X10 8 N/m 2. In this study, the minimum natural frequency of 2 kHz is chosen as a hard constraint in order to obtain a bandwidth at least of 400 Hz to meet requirements for airbag application. From the modal analysis, the structure with four beams connected in the middle of each of the four sides of the proof mass and the structure with eight beams surrounding the proof mass has demonstrated more than the acceptable natural frequency with 6.79 kHz and 2.00 kHz respectively. From this study, it has been shown that the structure with a proof mass surrounded by eight beams is the best choice for achieving maximum mechanical sensitivity and desirable resonant frequency for airbag sensor applications.

References

N. Yazdi, F. Ayazi, and K. Najafi. “Micromachined inertial sensors,” Proceedings of the IEEE, vol. 86, no. 8, pp. 1640–1659, 1998.

A.Ravi Sankar, S.Das, S.K Lahiri. “Cross-axis sensitivity reduction of a silicon MEMS piezoresistive accelerometer,” Microsystem Technologies, vol. 15, pp. 511–518, 2009.

M. Messina, J. Njuguna, V. Dariol, C. Pace, and G. Angeletti, “Design and simulation of a novel biomechanic piezoresistive sensor with silicon nanowires,” IEEE/ASME Trans. Mechatronics, vol. 18, no. 3, pp. 1201–1210, 2013.

G. Ionascu, A. Sandu, L. Bogatu, C. D. Comeaga, E. Manea, and D. Besnea, “Simulation Aspects of Performance and Experimental Procedures for a microaccelerometer,” U.P.B.Sci.Bull.,Series D, vol. 74, 2012.

M. C. Mathew, J. G. Jency, and P. G. Scholar, “A Review on Optimized Accelerometer Design for High Performance Application,”

International Journal of Computer Applications, no. 0975–8887, pp. 32–37, 2013.

T. D.Tran. “Optimum Design Considerations for a 3-DOF Micro Accelerometer Using Nanoscale Piezoresistors,” 3rd IEEE Int. Conf. on Nano/Micro Engineered and Molecular Systems, pp. 770–773, 2008.

D. V. Dao, S. Okada, V. T. Dau, T. Toriyama, and S. Sugiyama,“Development of a 3-DOF silicon piezoresistive micro accelerometer,” Proceedings of the 2004 Int. Symp. on Micro-Nanomechatronics and Human Science and The Fourth Symp. Micro-Nanomechatronics for Information-Based Society, pp. 1–6, 2004.

S.Kavitha, R. J. Daniel, and K. Sumangala, “Computer Aided Design and Effects of Beam Placement in Bulk Micromachined Piezoresistive MEMS Accelerometer for Concrete SHM Applications,” Procedia Engineering, vol. 38, pp. 2033–2047, 2012.

Yi Luo. “Cross Axis Sensitivity Enhancement For A Quad Beam Piezoresistive Accelerometer,” 26th IEEE Canadian Conference Of Electrical And Computer Engineering (CCECE),vol. 6, pp. 5–8, 2013.

A. Benichou, “Study of a Three-Axis Piezoresistive Accelerometer,” Proceedings of the 1st Annual International Interdisciplinary Conference, AIIC, no. 1, pp. 24–26, 2013.

C. Du, C. He, J. Yu, X. Ge, Y. Zhang, and W. Zhang, “Design and

measurement of a piezoresistive triaxial accelerometer based on MEMS technology,” Journal of Semiconductors., vol. 33, no. 10, p.104005, 2012.

K.H. Kim, J.S. Ko, C. Young-Ho, K. Lee, B.M. Kwak, K. Park, “A

skew-symmetric cantilever accelerometer for automotive airbag applications,” Sensors and Actuators A, no. 50., pp.121-126, 1995.

Y. C. Tang, Bin, Shiwei Xi, Mingqiu Yao, De Zhang, Kazuo Sato, Guofen Xie, Wei Su. “Fabrication of A Symmetrical Accelerometer

Structure,” Proceedings of the IEEE , pp 1-6 , April 2014.

M. Messina and J. Njuguna, “Potential of silicon nanowires structures as nanoscale piezoresistors in mechanical sensors,” IOP Conf. Ser. Mater. Sci. Eng., vol. 40, p. 012038, 2012.

H. Chen, M. Bao, H. Zhu, and S. Shen, “A piezoresistive accelerometer with a novel vertical beam structure,” Sensors Actuators A Phys., vol. 63, no. 1, pp. 19–25, 1997.

M. H. M. Khir, P. Qu, and H. Qu, “A low-cost CMOS-MEMS piezoresistive accelerometer with large proof mass,” Sensors (Basel).,vol. 11, no. 8, pp. 7892–907, 2011.

W. Benecke, “Micromechanical sensors,” Proceedings. VLSI Computer. Peripherals, COMPEURO 89, pp. 1–20, 1989.

K. Naeli, Optimization of Piezoresistive Cantilevers for Static and Dynamic Sensing Applications, 2009.

M. Messina, “Design and optimization of a novel tri-axial miniature ear plug piezoresistor accelerometer with nanoscale piezoresistors,”.

J. Wang, X. Xia, and X. Li. “Monolithic Integration of Pressure Plus Acceleration Composite TPMS Sensors With a Single-Sided Micromachining Technology,” Journal of Microelectromechanical Systems., vol. 21, no. 2, pp. 284–293, 2012.

A. R. Sankar, J. G. Jency, and S. Das, “Design, fabrication and testing of a high performance silicon piezoresistive Z-axis accelerometer with proof mass-edge-aligned-flexures,” Microsystem technologies., vol. 18, no. 1, pp. 9–23, 2011.

Downloads

Published

2017-03-15

How to Cite

Yusof, N., Soinb, N., & C.W. Noorakma, A. (2017). Effect of Beams Structures on Dynamic Behavior of Piezoresistive Accelerometer Sensors. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 9(1-4), 77–81. Retrieved from https://jtec.utem.edu.my/jtec/article/view/1784

Issue

Vol. 9 No. 1-4: Smart City Technology in Communication and Computer Engineering II

Section

Articles

License

TRANSFER OF COPYRIGHT AGREEMENT

The manuscript is herewith submitted for publication in the Journal of Telecommunication, Electronic and Computer Engineering (JTEC). It has not been published before, and it is not under consideration for publication in any other journals. It contains no material that is scandalous, obscene, libelous or otherwise contrary to law. When the manuscript is accepted for publication, I, as the author, hereby agree to transfer to JTEC, all rights including those pertaining to electronic forms and transmissions, under existing copyright laws, except for the following, which the author(s) specifically retain(s):

  1. All proprietary right other than copyright, such as patent rights
  2. The right to make further copies of all or part of the published article for my use in classroom teaching
  3. The right to reuse all or part of this manuscript in a compilation of my own works or in a textbook of which I am the author; and
  4. The right to make copies of the published work for internal distribution within the institution that employs me

I agree that copies made under these circumstances will continue to carry the copyright notice that appears in the original published work. I agree to inform my co-authors, if any, of the above terms. I certify that I have obtained written permission for the use of text, tables, and/or illustrations from any copyrighted source(s), and I agree to supply such written permission(s) to JTEC upon request.