The Effect of Thermal Perturbation on a Polymer Material’s Tensile Test via Simulation and Experimental Analysis

Authors

  • M.Q. Sazali Department of Mechanical and Manufacturing Engineering, Universiti Malaysia Sarawak, Malaysia.
  • M.S.Z.M. Suffian Department of Mechanical and Manufacturing Engineering, Universiti Malaysia Sarawak, Malaysia.
  • A.A. Khan Department of Mechanical and Manufacturing Engineering, Universiti Malaysia Sarawak, Malaysia.
  • A. Yassin Department of Mechanical and Manufacturing Engineering, Universiti Malaysia Sarawak, Malaysia.
  • S. Mohamaddan Department of Mechanical and Manufacturing Engineering, Universiti Malaysia Sarawak, Malaysia.
  • M. Yusof Department of Mechanical and Manufacturing Engineering, Universiti Malaysia Sarawak, Malaysia.
  • S.A. Rashidi Department of Mechanical Engineering, Universiti Malaya, Malaysia.
  • M.H.I. Saad Department of Electrical and Electronic Engineering, Universiti Malaysia Sarawak, Malaysia.

Keywords:

Tensile Test, Simulation Analysis, Polymer Material, Thermal Perturbation.

Abstract

Polymers are made from pieces of monomer that can be connected into a long chain. Natural rubber is studied in this research. In this research, tensile testing was conducted to the rubber specimen in order to check the heat release from the specimen. A thermocouple device was used to measure the specimen's temperature during tensile testing. The data from the tensile test were used to generate the stress vs strain curve. Computer simulation study was also performed. The results show that the temperature reading from the thermocouple device has increased to prove that there was a heat release from the tensile test. The heat was detected after the specimen’s fracture. The simulation test proved the same phenomena as the experimental test.

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Published

2016-12-01

How to Cite

Sazali, M., Suffian, M., Khan, A., Yassin, A., Mohamaddan, S., Yusof, M., Rashidi, S., & Saad, M. (2016). The Effect of Thermal Perturbation on a Polymer Material’s Tensile Test via Simulation and Experimental Analysis. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 8(12), 141–145. Retrieved from https://jtec.utem.edu.my/jtec/article/view/1450

Issue

Vol. 8 No. 12: Innovative Solutions for Engineering and Technology Challenges

Section

Articles

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