Optimal Thermal Distribution by using Inverse Genetic Algorithm Optimization Technique
Keywords:Components Placement Design, Fitness Function, Inverse Genetic Algorithm, Optimization
AbstractOptimal arrangement of components on printed circuit board (PCB) has become a basic necessity so as to have effective management of heat generation and dissipation. In this work, Inverse Genetic Algorithm (IGA) optimization has been adopted in order to achieve this objective. This paper proposes IGA search engine to optimize the thermal profile of components based on thermal resistance network and to minimize the area of PCB. Comparison between the proposed IGA and the conventional GA (FGA) performances are extensively analyzed. Unlike the conventional FGA, the IGA approach allows the user to set the desired fitness, so that the GA process will try to approach these set values. A reduction in the overall computational time and the freedom of choosing a desired fitness are the major advantages of IGA over FGA. From the simulation results, the IGA has successfully minimized the thermal profile and area of PCB by 0.78% and 1.28% respectively. The computational time has also been minimized by 15.56%.
S.-Y. Huang, Y.-S. Cheng, C.-Y. Huang, B. Liu, S. Chang, D. Chiang, P. Gu, and R.-B. Wu, “Efficient multi-node optimal placement for decoupling capacitors on PCB,” 2014 IEEE 18th Work. Signal Power Integr., pp. 1–4, 2014.
A. Fodor, R. Jánó, and D. Pitica, “Component Placement Optimizations on PCBs for Improved Thermal Behaviour,” in 38th Int. Spring Seminar on Electronics Technology, 2015, pp. 114–117.
T. Chen, J. Luo, and Y. Hu, “Component placement process optimization for multi-head surface mounting machine based on tabu search and improved shuffled frog-leaping algorithm,” 2011 3rd Int. Work. Intell. Syst. Appl. ISA 2011 - Proc.
T. Suwa and H. Hadim, “Multidisciplinary Placement Optimization of Heat Generating Electronic Components on a Printed Circuit Board in an Enclosure,” in IEEE Transanction on Components and Packaging Technologies, Vol. 30, 2007, no. 3, pp. 402–410.
F. S. Ismail, R. Yusof, and M. Khalid, “Optimization of electronics component placement design on PCB using self organizing genetic algorithm (SOGA),” J. Intell. Manuf., vol. 23, no. 2012, pp. 883–895, 2012.
H. Tamaki, H. Kita, and S. Kobayashi, “Multi-objective optimization by genetic algorithms: a review,” Evol. Comput. 1996., Proc. IEEE Int. Conf., pp. 517–522.
A. Garcia-naijera and C. A. Brizuela, “PCB Assembly : An Efficient Genetic Algorithm for Slot Assignment and Component Pick and Place Sequence Problems,” in IEEE International conference on Components Packaging and Manufacturing, 2005, pp. 1485–1492.
C. M. Fonseca and P. J. Fleming, “Multiobjective genetic algorithms made easy: selection sharing and mating restriction,” Int. Conf. Genet. Algorithms Eng. Syst. Innov. Appl. (GALESIA 1995), no. September, pp. 45–52, 1995.
P. Guo, X. Wang, and Y. Han, “The enhanced genetic algorithms for the optimization design,” 2010 3rd Int. Conf. Biomed. Eng. Informatics, no. Bmei, pp. 2990–2994.
A. Patnaik and L. Behera, “Diversity improvement of solutions in multiobjective genetic algorithms using pseudo function inverses,” Conf. Proc. - IEEE Int. Conf. Syst. Man Cybern., pp. 2232–2237, 2011.
Q. C. Meng, T. J. Feng, Z. Chen, C. J. Zhou, and J. H. Bo, “Genetic algorithms encoding study and a sufficient convergencencondition of GAs,” IEEE SMC’99 Conf. Proceedings. 1999 IEEE Int. Conf. Syst. Man, Cybern. (Cat. No.99CH37028), vol. 1, pp. 649–652.
Z. Guohui, L. Zongbin, and D. Xuan, “A Hybrid Genetic Algorithm to Optimize the Printed Circuit Board Assembly Process,” in 2010 IEEE International Scientific and Technological Conference, Shannxi Province, China., 2010, pp. 563–567.
L. Beghou, F. Costa, and L. Pichon, “Detection of Electromagnetic Radiations Sources at the Switching Time Scale Using an Inverse Problem-Based Resolution Method ; Application to Power Electronic Circuits,” IEEE Trans. Electromagn. Compat., vol. 57, no. 1, pp. 52–60, 2015.
F. T. Abiodun and F. S. Ismail, “Pump scheduling optimization model for water supply system using AWGA,” 2013 IEEE Symp. Comput. Informatics, pp. 12–17.
A. H. F. Dias and J. a De Vasconcelos, “Multiobjective genetic algorithms applied to solve optimization problems,” Magn. IEEE Trans., vol. 38, no. March, pp. 1133–1136, 2002.
S. Bhardwaj, “A Particle Swarm Optimization Approach for Cost Effective SaaS Placement on Cloud,” in IEEE International conference on Computing and Automation (ICCCA 2015), 2015, pp. 686–690.
M. Mitchell, A. Arbor, S. Forrest, J. H. Holland, and A. Arbor, “The Royal Road for Genetic Algorithms : Fitness Landscapes and GA Performance ∗,” Proc. first Eur. Conf. Artif. Life Cambridge, MA MIT Press. 1992., vol. 4, no. 1, pp. 1–11.
M. Zainolarifin, M. Hanafi, and F. S. Ismail, “Heat Sink Model and Design Analysis Based on Particle Swarm Optimization,” in 2014 IEEE Innovative Smart Grid Technologies - Asia (ISGT ASIA), 2014, pp. 726–731.
C. A. Rubio-jimenez, S. G. Kandlikar, and A. Hernandez-guerrero, “Numerical Analysis of Novel Micro Pin Fin Heat Sink With Variable Fin Density,” in EEE Transanction on Components,Packaging and Manufacturing Technology, Vol. 2, No. 5, May 2012, 2012, no. May, pp. 825–833.
S. Manivannan, R. Arumugam, S. P. Devi, S. Paramasivam, P. Salil, and B. Subbarao, “Optimization of Heat Sink EMI Using Design of Experiments with Numerical Computational Investigation and Experimental Validation,” IEEE Trans. Automat. Contr., pp. 295–300, 2010.
D. Wang, H. Lu, Z. Xiao, and M.-H. Yang, “Inverse Sparse Tracker With a Locally Weighted Distance Metric,” IEEE Trans. Image Process., vol. 24, no. 9, pp. 2646–2657, 2015.
S. P. Gurrum, M. D. Romig, S. J. Horton, and D. R. Edwards, “A quick PCB thermal calculator to aid system design of exposed pad packages,” Annu. IEEE Semicond. Therm. Meas. Manag. Symp., pp. 63–69.
M. N. C. Soh, I. Bugis, I. W. Jamaludin, and R. Ranom, “Thermal analysis on PCB using Galerkin approach,” 2011 4th Int. Conf. Model. Simul. Appl. Optim. ICMSAO 2011, pp. 2–7.
D. Gopinath, Y. Joshi, S. Member, and S. Azarm, “An Integrated Methodology for Multiobjective Optimal Component Placement and Heat Sink Sizing,” IEEE Trans. COMPONENTS Packag. Technol., vol. 28, No. 4., no. December, pp. 869–876, 2005.
L. Coppola, B. Agostini, R. Schmidt, and R. Faria Barcelos, “Influence of connections as boundary conditions for the thermal design of PCB traces,” IEEE Int. Symp. Ind. Electron., 2010, pp. 884–888.
Y. Z. Wu and P. Ji, “Optimizing feeder arrangement of a PCB assembly machine for multiple boards,” IEEM2010 - IEEE Int. Conf. Ind. Eng. Eng. Manag., pp. 2343–2347.
M. Felczak and B. Wiȩcek, “Optimal placement of eletronic devices in forced convective cooling conditions,” Proc. 14th Int. Conf. "Mixed Des. Integr. Circuits Syst. Mix. 2007, pp. 387–391.
F. Alexandra, J. Rajmond, and P. Dan, “Flow Simulations for Ccomponent Spacing Optimization on PCB Boards,” IEEE 20th Int. Symp. Des. Technol. Electron. Packag., vol. 23–26 oCT , pp. 149–152.
C. M. Fonseca and P. J. Fleming, “Multiobjective optimization and multiple constraint handling with evolutionary algorithms - Part I: A unified formulation,” IEEE Trans. Syst. Man, Cybern. Part ASystems Humans., vol. 28, no. January, pp. 26–37, 2005.
C. Fernandes and A. Rosa, “A study on non-random mating and varying population size in genetic algorithms using a royal road function,” Proc. 2001 Congr. Evol. Comput. (IEEE Cat. No.01TH8546), vol. 1, pp. 60–66..
B. Doerr, M. Kunnemann, and Ieee, “Royal Road Functions and the (1+lambda) Evolutionary Algorithm: Almost no Speed-Up from Larger Offspring Populations,” 2013 IEEE Congr. Evol. Comput., vol. 23, no. 4, pp. 424–431.
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