Implementation of SOI-Based Rib Waveguide for High-Speed Optical Interconnect

Authors

  • Siti Sarah Md Sallah Faculty of Engineering and Build Environment, Universiti Kebangsaan Malaysia, 43650 Bangi, Selangor, Malaysia.
  • Sawal Hamid Md Ali Faculty of Engineering and Build Environment, Universiti Kebangsaan Malaysia, 43650 Bangi, Selangor, Malaysia.
  • P. Susthitha Menon Institute of Microengineering and Nanophotonics (IMEN), Universiti Kebangsaan Malaysia, 43650 Bangi, Malaysia.
  • Nurjuliana Juhari School of Microelectronic Engineering, Universiti Malaysia Perlis, Campus Pauh, 02600, Arau, Perlis, Malaysia.
  • Md Shabiul Islam Institute of Microengineering and Nanophotonics (IMEN), Universiti Kebangsaan Malaysia, 43650 Bangi, Malaysia. Faculty of Engineering, Multimedia University, 63000 Cyberjaya, Selangor, Malaysia.

Keywords:

Effective Index (neff), Etch Depth (d), Optical Interconnect (OI), Rib Waveguide, Slab Height (h), Width (W)

Abstract

Silicon based photonics have generated strong interest in recent years, mainly in optical waveguide interconnects for microelectronic circuits. This paper presents a single mode condition (SMC) of SOI-based rib waveguide for high-speed Optical Interconnect (OI) implementation at a circuit level. In OptiBPM, a correlation analysis between two parameters, etched rib thickness (r) and effective index (neff) was investigated to identify the effects of width (W) on the rib waveguide. The waveguide performance of the OI links such as output power, propagation loss and propagation delay was recorded based on OptiSPICE simulation. A wavelength (λ) of 1550 nm has the advantages of low power loss and delay which makes it reliable for high-speed OI applications.

Downloads

Published

2017-04-15

How to Cite

Md Sallah, S. S., Md Ali, S. H., Menon, P. S., Juhari, N., & Islam, M. S. (2017). Implementation of SOI-Based Rib Waveguide for High-Speed Optical Interconnect. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 9(2), 17–22. Retrieved from https://jtec.utem.edu.my/jtec/article/view/985

Issue

Vol. 9 No. 2: April - June 2017

Section

Articles

License

TRANSFER OF COPYRIGHT AGREEMENT

The manuscript is herewith submitted for publication in the Journal of Telecommunication, Electronic and Computer Engineering (JTEC). It has not been published before, and it is not under consideration for publication in any other journals. It contains no material that is scandalous, obscene, libelous or otherwise contrary to law. When the manuscript is accepted for publication, I, as the author, hereby agree to transfer to JTEC, all rights including those pertaining to electronic forms and transmissions, under existing copyright laws, except for the following, which the author(s) specifically retain(s):

  1. All proprietary right other than copyright, such as patent rights
  2. The right to make further copies of all or part of the published article for my use in classroom teaching
  3. The right to reuse all or part of this manuscript in a compilation of my own works or in a textbook of which I am the author; and
  4. The right to make copies of the published work for internal distribution within the institution that employs me

I agree that copies made under these circumstances will continue to carry the copyright notice that appears in the original published work. I agree to inform my co-authors, if any, of the above terms. I certify that I have obtained written permission for the use of text, tables, and/or illustrations from any copyrighted source(s), and I agree to supply such written permission(s) to JTEC upon request.