Novel Spiral With and Without Patch EBG Structures for EMI Reduction

Authors

  • Zuhairiah Zainal Abidin Center for Applied Electromagnetic, Universiti Tun Hussein Onn Malaysia, 86400 Johor, Malaysia .
  • Musaab Abdulghani Qasem Center for Applied Electromagnetic, Universiti Tun Hussein Onn Malaysia, 86400 Johor, Malaysia .
  • Samsul Haimi Dahlan Center for Applied Electromagnetic, Universiti Tun Hussein Onn Malaysia, 86400 Johor, Malaysia .
  • Mohd Zarar Mohd Jenu Center for Applied Electromagnetic, Universiti Tun Hussein Onn Malaysia, 86400 Johor, Malaysia .

Keywords:

Electromagnetic Bandgap (EBG), Electromagnetic Interference (EMI), Electromagnetic Compatibility (EMC), Radiated Emission (RE),

Abstract

Electromagnetic bandgap structures (EBGs) have the ability to provide excellent reduction of electromagnetic interference (EMI). In this work, a 3 by 3 spiral with and without patch electromagnetic bandgap planar was fabricated on low cost FR4 substrate with permittivity of 4.3 and thickness of 1.6mm. Both designs have dimensions of 36 mm x 36 mm covering 9 unit cells planar design. The simulation and experimental characteristics are illustrated in this paper. An acceptable agreement between the simulated and measured results was obtained. It was found that the spiral without patch EBG experienced better bandgap than the spiral with patch design, which covered bandgap of (5.8 – 7.4 GHz) with relative bandwidth of 22.56%. Meanwhile, for the spiral with patch structure, it covered C band (4.5 – 7 GHz) with extended relative bandwidth of 43%. The results of the characteristics demonstrate that the proposed EBGs are attractive candidates for the integration into the high speed circuitry designs where spiral with patch can be involved in C band applications to suppress the EMI emitted by their circuitry.

Downloads

Published

2017-04-01

How to Cite

Zainal Abidin, Z., Abdulghani Qasem, M., Dahlan, S. H., & Mohd Jenu, M. Z. (2017). Novel Spiral With and Without Patch EBG Structures for EMI Reduction. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 9(1-5), 23–26. Retrieved from https://jtec.utem.edu.my/jtec/article/view/1826

Issue

Vol. 9 No. 1-5: Smart City Technology in Communication and Computer Engineering III

Section

Articles

License

TRANSFER OF COPYRIGHT AGREEMENT

The manuscript is herewith submitted for publication in the Journal of Telecommunication, Electronic and Computer Engineering (JTEC). It has not been published before, and it is not under consideration for publication in any other journals. It contains no material that is scandalous, obscene, libelous or otherwise contrary to law. When the manuscript is accepted for publication, I, as the author, hereby agree to transfer to JTEC, all rights including those pertaining to electronic forms and transmissions, under existing copyright laws, except for the following, which the author(s) specifically retain(s):

  1. All proprietary right other than copyright, such as patent rights
  2. The right to make further copies of all or part of the published article for my use in classroom teaching
  3. The right to reuse all or part of this manuscript in a compilation of my own works or in a textbook of which I am the author; and
  4. The right to make copies of the published work for internal distribution within the institution that employs me

I agree that copies made under these circumstances will continue to carry the copyright notice that appears in the original published work. I agree to inform my co-authors, if any, of the above terms. I certify that I have obtained written permission for the use of text, tables, and/or illustrations from any copyrighted source(s), and I agree to supply such written permission(s) to JTEC upon request.