Syafaah L, Widianto W, Yotsuyanagi H, Hashizume M. Bi-directional of a Built-in Test Circuit for Interconnect Defects in Assembled PCBs. JTEC [Internet]. 2017Mar.15 [cited 2024Dec.21];9(1-3):31-4. Available from: https://jtec.utem.edu.my/jtec/article/view/1738