Syafaah, Lailis, Widianto Widianto, Hiroyuki Yotsuyanagi, and Masaki Hashizume. “Bi-Directional of a Built-in Test Circuit for Interconnect Defects in Assembled PCBs”. Journal of Telecommunication, Electronic and Computer Engineering (JTEC) 9, no. 1-3 (March 15, 2017): 31–34. Accessed May 29, 2024. https://jtec.utem.edu.my/jtec/article/view/1738.