Alia, F. A., Odoriba, A., Hashizume, M., Yotsuyanagi, H. and Lu, S.-K. (2017) “Electrical Tests for Capacitive Open Defects in Assembled PCBs”, Journal of Telecommunication, Electronic and Computer Engineering (JTEC), 9(3-2), pp. 49–52. Available at: https://jtec.utem.edu.my/jtec/article/view/2812 (Accessed: 26July2024).