ONG, L. L.; CHAN, Y. K.; YOU, A. H. Optimisation of Fine Pitch Contactor and Test Board for QFN Package. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), [S. l.], v. 8, n. 9, p. 13–17, 2016. Disponível em: https://jtec.utem.edu.my/jtec/article/view/795. Acesso em: 26 apr. 2024.