ALIA, F. A.; ODORIBA, A.; HASHIZUME, M.; YOTSUYANAGI, H.; LU, S.-K. Electrical Tests for Capacitive Open Defects in Assembled PCBs. Journal of Telecommunication, Electronic and Computer Engineering (JTEC), [S. l.], v. 9, n. 3-2, p. 49–52, 2017. Disponível em: https://jtec.utem.edu.my/jtec/article/view/2812. Acesso em: 25 apr. 2024.